Equipment Photolithograpy Laser Lithography System (Heidelberg Instruments DWL 66+) Contact Mask Aligner (KARL SUSS MA-6) Contact Mask Aligner (KARL SUSS MJB3) Automatic Coater (Suss MicroTec Delta 80 RC) Automatic Developer (Suss MicroTec Delta 8+) Vacuum Oven with NH3 for reversal image (YES-310TA(E)) Dry Film Laminator (JSE JSL-1200) Flood Exposure Tool (OAI-150) Wet bench for resist coating and bakes Wet benches for resist stripping and cleaning Plasma Asher (Axic HF-8) Chrome mask processing tool Wet benches for resist development Laser Lithography System Heidelberg Instruments MLA 150 Nanopatterning E-Beam Lithography (Raith EBPG 5200) Etching Reactive Ion Etching (RIE) ICP Etcher (Plasma-Therm Shuttleline (Chlorine Chemistry)) ICP Deep RIE (Plasma-Therm Versaline (Fluorine Chemistry)) Wet etching benches (RCA clean, Buffered Oxide etch, Isotropic Silicon etch, Aluminium etch, Si3N4 etch, Anisotropic Silicon etch (KOH), Chromium etch) Material Deposition and Annealing Plasma-Enhanced Chemical Vapor Deposition (PE-CVD) Tube Furnaces (BTI-Bruce RTRI-878) E-beam Evaporator (Evatec BAK-501A) E-beam Evaporator (Airco Temescal BJD 1800) E-beam Evaporator (Airco Temescal FC 1800) Thermal Evaporator (Vinci PVD-4) Sputter Deposition (AJA International Inc. ATC 2200) Plasma-Assisted Atomic Layer Deposition (Ultratech/Cambridge Nanotech Fiji G2) Molecular Vapor Deposition (AMTS 100E) Rapid Thermal Annealing (Jipelec JetFirst 200HT) Alox Oxidation Furnace Printing No posts found. Characterization and Analysis HR-SEM (Hitachi S-4700) Atomic Force Microscope (DI-3000) Atomic Force Microscope (Asylum Research/Oxford Instruments MFP-3D Infinity) Surface Profiler (KLA Tencor P-6) Film thickness measurement (Nanometrics AFT 2100 Nanospec) Ellipsometer (Rudolph AutoEL II) Ellipsometer Multi-layer measurements wave length 193-2500nm (Woollam VASE) Ellipsometer (Woollam M-2000UI) Film stress measurement (Tencor FLX-2320) C-V Plotter (MDC) FPP-5000 Automatic Resistivity Meter CDs Optical Measurements (Vickers micro-system) Optical Microscope with a camera (Nikon Eclipse L200) Optical Microscope (Nikon Labophot-2) Optical Microscopes with a camera (Olympus BX-60) Optical Microscope (Zeiss Axiotron) Contact Angle Goniometer (Ramé-hart 200) Clara4 SEM Raman WITec (alpha300) Packaging Wire Bonder (TPT HB16) Dicer (Disco DAD3350) 2D Center Transfer Station for 2D Materials Transfer and Heterostack Devices Preparation Inert Atmosphere Transfer Station for 2D Materials Transfer and Heterostack Devices Preparation CVD Furnace for Graphene Growth Cleaning and Annealing Furnace
