Vendor: Disco, Model: DAD-3350
Contact: Dima Peselev (04-8295125, pesel@ee.technion.ac.il)
High speed and accuracy dicing tool.
Specifications:
- Universal chuck can accept up to 6” wafer
- Cutting speed up to 6mm/sec (depends on substrate type and thickness)
- Position accuracy: 2 microns; Z accuracy 2-3 microns
- Micro and Macro CCD Cameras
- Auto alignment and auto kerf check options are available