Vendor: Tencor, Model: FLX-2320
Contact: Dr. Orna Ternyak (04-829-4204, ornater@technion.ac.il)
Flexus (Tencor FLX-2320) is a non-contact thin-film stress measurement instrument which is based on a laser scan technique. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film on the substrate. The stress in the thin film is calculated using the Stoney equation. Successful stress measurement can be performed only on blank, not patterned wafers with highly reflective surface.
Specifications:
- Two solid-state Class III lasers (can be automatically selected): 670nm and 750nm
- PC-controlled measurements, data acquisition, and result calculation. The PC is running WINDOWS 3.1
- The tool is currently configured for 4″ and 6″ wafers (Only a whole wafer can be measured)