Vendor: TPT, Model: HB16
Contact: Yacov Shneider (04-8294205, shneider@ee.technion.ac.il)
Thermosonic wire bonder for wedge and ball bonding
Specifications:
- Automatic bond height adjustment
- Stage:
- Y and Z axis stage
- Heated work stages Ø 60 mm / 100 x 150 mm2
- DIL and TO5/TO8 adapter
- Standard:
- Wire diameter 17, 25, 50, 75 µm pure gold, ribbon
- Wedge bonding tool for Ø 25µm gold wire
- Ball bonding capillary for Ø 25µm gold wire
- Loop profile with up to 10 steps
- Features:
- Ultrasonic, Thermo-compression and thermosonic capability
- Sample size up to 100 x 150 mm2
- Ultrasonic transducer (62 kHz, up to 2 W power)
- Sample (chip) holder heated up to 250 °C, bonding tool heatable
- Gold or AlSi wires with diameters from 17 µm up to 75 µm and up to 25 µm x 250 µm ribbon compatible
- Adjustable wire loop between first and second bond with motorized holder movement
- controlling software allows the possibility to store up to 100 recipes