Plasma Asher (YES G-1000)

Vendor: YES, Model: G-1000

Contact: Dr. Orna Ternyak (04-829-4204, ornater@ee.technion.ac.il)

YES G-1000 is a vacuum plasma cleaning system. Available gases are: O2 and Ar. Can be used for resist stripping, patterned resist descum, wafer cleaning.

Applications:

  • Removing organic contaminants (O2 plasma)
  • Wire bond surface preparation (Ar plasma)
  • Promoting adhesion between two surfaces
  • Controlling surface tension to achieve a hydrophilic surface
  • Increasing biocompatibility
  • Improving polymer performance through cross-linking to decrease friction

Specifications:

  • 40 KHz power source, up to 1000 Watts
  • Thermocouple monitoring of wafer temperature during etching to avoid an overheating of sensitive samples
  • Five plasma mode selections:
  1. Downstream/Electron-Free Plasma-for cleaning of parts that are susceptible to electron damage.
  2. Active Plasma-for more aggressive cleaning of parts that are not sensitive to electron damage.
  3. Reactive Ion Etch Plasma-for more aggressive cleaning of nonsensitive parts.
  4. Active Ion Trap-for the most aggressive plasma in reactive processes.
  5. Downstream/Electron-Free Ion Trap-for aggressive cleaning of parts that are susceptible to electron damage.